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机译:亚微米Accurac金对金互连倒装芯片键合方法,用于电子-光学异构集成
Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST),Tsukuba, Ibaraki 305-8568, Japan,Institute of Photonics-Electronics Convergence System Technology (PECST), AIST, Tsukuba, Ibaraki 305-8568, Japan;
Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST),Tsukuba, Ibaraki 305-8568, Japan,Institute of Photonics-Electronics Convergence System Technology (PECST), AIST, Tsukuba, Ibaraki 305-8568, Japan;
Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST),Tsukuba, Ibaraki 305-8568, Japan;
Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST),Tsukuba, Ibaraki 305-8568, Japan;
Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST),Tsukuba, Ibaraki 305-8568, Japan;
Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST),Tsukuba, Ibaraki 305-8568, Japan,Institute of Photonics-Electronics Convergence System Technology (PECST), AIST, Tsukuba, Ibaraki 305-8568, Japan;
机译:通过直接氧化物粘接和通孔 - 最后3-D互连通过直接氧化物粘接和通过最后3-D互连的非均相集成
机译:将40/45 nm ELK器件集成到引线键合和倒装芯片封装中的封装方法
机译:专为TCP金对金内部引线键合设计的调节方法
机译:基于使用失准自校正元件的倒装芯片键合的高精度异构集成
机译:使用倒装芯片键合的自由空间光互连的混合光接收器的设计和制造。
机译:带有毛细管自组装的氧化物-氧化物热压直接键合技术用于多芯片至晶圆异质3D系统集成
机译:使用SNBI焊料的倒装芯片粘合的智能织物芯片互连过程
机译:用于倒装芯片连接互连技术的聚合物/金属浆料的材料开发。季度报告