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首页> 外文期刊>Japanese journal of applied physics >Device characteristics of the thin-film silicon-on-insulator power MOSFETs at high temperatures
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Device characteristics of the thin-film silicon-on-insulator power MOSFETs at high temperatures

机译:薄膜绝缘体上硅功率MOSFET在高温下的器件特性

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摘要

In this paper, we report high-temperature (up to 573 K) device characteristics, such as subthreshold characteristics, threshold voltage, on-resistance, breakdown characteristics, breakdown voltage, and leakage current, for the thin-film silicon-on-insulator power MOSFETs based on experimental results. The subthreshold slope, on-resistance, and leakage current increase with increasing temperature. The breakdown voltage and threshold voltage decrease with increasing temperature. Dependences of these characteristics on the channel and drift lengths are also analyzed.
机译:在本文中,我们报告了薄膜绝缘体上硅的高温(最高573 K)器件特性,例如亚阈值特性,阈值电压,导通电阻,击穿特性,击穿电压和泄漏电流基于实验结果的功率MOSFET。亚阈值斜率,导通电阻和泄漏电流随温度升高而增加。击穿电压和阈值电压随温度升高而降低。还分析了这些特性对通道和漂移长度的依赖性。

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