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High-temperature characteristics of zone-melting recrystallized silicon-on-insulator MOSFETs

机译:区域熔化的重结晶绝缘体上硅MOSFET的高温特性

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摘要

The characteristics of enhancement-mode MOS transistors fabricated on zone-melting recrystallized (ZMR) silicon-on-insulator (SOI) films were systematically experimentally investigated in the temperature range 25–300°C. The main temperature-dependent parameters (the threshold voltage, the channel mobility, subthreshold slope, off-state leakage currents) of ZMR SOI MOSFETs are described and compared with both theory and SIMOX devices. It is shown that high carrier mobilities and low off-state leakage currents can be obtained in thin-film ZMR SOI MOSFETs at elevated temperatures. At T = 300°C, far beyond the operating range of bulk silicon devices, the off-state leakage current in ZMR SOI MOSFETs with a 0.15 mm-thick silicon film was only 0.5 nA/mm (for VD = 3 V), that is 3–4 orders of magnitude lower than typical values in bulk Si devices. The presented results demonstrate that CMOS devices fabricated on sufficiently thin ZMR SOI films are well suited for high-temperature applications.
机译:在25-300°C的温度范围内,系统地实验研究了在区域熔化重结晶(ZMR)绝缘体上硅(SOI)膜上制造的增强模式MOS晶体管的特性。描述了ZMR SOI MOSFET的主要温度相关参数(阈值电压,沟道迁移率,亚阈值斜率,截止状态漏电流),并将其与理论器件和SIMOX器件进行了比较。结果表明,在高温下,薄膜ZMR SOI MOSFET可以获得高载流子迁移率和低截止态泄漏电流。在T = 300°C时,远远超出了体硅器件的工作范围,具有0.15 mm厚硅膜的ZMR SOI MOSFET的截止态泄漏电流仅为0.5 nA / mm(对于VD = 3 V),比块状硅器件的典型值低3-4个数量级。呈现的结果表明,在足够薄的ZMR SOI膜上制造的CMOS器件非常适合高温应用。

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