首页> 外文期刊>International Journal of Microcircuits & Electronic Packaging >Multiobjective Design Optimization of MicroChannel Cooling System Using High Performance Thermal Vias in LTCC Substrates
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Multiobjective Design Optimization of MicroChannel Cooling System Using High Performance Thermal Vias in LTCC Substrates

机译:LTCC基板中使用高性能散热孔的微通道冷却系统的多目标设计优化

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摘要

Increased heat generation in semiconductor devices for demanding applications leads to the investigation of highly efficient cooling solutions. Effective options for thermal management include passing of cooling liquid through the microchannel heat sink and using highly conductive materials. In the author's previous work, experimental and computational analyses were performed on LTCC substrates using embedded silver vias and silver columns forming microchannels. This novel technique of embedding silver vias along with forced convection using a coolant resulted in higher heat transfer rates. The present work investigates the design optimization of this cooling system (microheat exchanger) using systems optimization theory. A new multiobjective optimization problem was formulated for the heat transfer in the LTCC model using the log mean temperature difference (LMTD) method of heat exchangers. The goal is to maximize the total heat transferred and to minimize the coolant pumping power. Structural and thermal design variables are considered to meet the manufacturability and energy requirements. Pressure loss and volume of the silver metal are used as constraints. A hybrid optimization technique using sequential quadratic programming (SQP) and branch and bound method of integer programming has been developed to solve the microheat exchanger problem. The optimal design is presented and sensitivity analysis results are discussed.
机译:在要求苛刻的应用中,半导体器件中产生热量的增加导致对高效冷却解决方案的研究。热管理的有效选择包括使冷却液通过微通道散热器,并使用高导热性材料。在作者先前的工作中,使用嵌入式银通孔和形成微通道的银柱在LTCC基板上进行了实验和计算分析。使用冷却剂将银通孔嵌入对流以及强制对流的新技术导致更高的传热率。本工作使用系统优化理论研究了该冷却系统(微型热交换器)的设计优化。使用换热器的对数平均温度差(LMTD)方法,为LTCC模型中的传热问题提出了一个新的多目标优化问题。目标是使传递的总热量最大化,并使冷却剂泵送功率最小。结构和热设计变量被认为满足可制造性和能量要求。压力损失和银金属的体积用作约束。为了解决微热交换器问题,已经开发出一种使用顺序二次规划(SQP)和整数规划的分支定界方法的混合优化技术。提出了最佳设计并讨论了灵敏度分析结果。

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