基于 LTCC 基板的 K 频段多通道发射组件

摘要

介绍了一种基于 LTCC 基板的 K 频段多通道发射组件。为了更好地满足散热要求,盒体采用了高导热率的无氧铜材料。针对无氧铜盒体与 LTCC 基板间热膨胀系数的差异,提出了一种将 LTCC 基板过渡到钼铜载体,再将钼铜载体烧焊到无氧铜盒体的工艺流程。组件有8个通道,各路通道输出功率为25 dBm,具有6位移相、5位衰减。研制结果表明组件性能优越、尺寸小、散热好,在高温85℃条件下工作时可以保证壳温≤90℃,长期工作可靠性高。%This paper introduces a K-band multi-channel transmitting module based on LTCC base plate.In order to meet the requirements of heat dissipation,the oxygen-free copper material with high thermal conductivity is adopted for the box.Aiming at the difference of thermal-expansion co-efficients between oxygen-free copper box and LTCC base plate,this paper puts forward a process flow that combines LTCC base plate with Mo-Cu carrier,and then sinters the Mo-Cu carrier on ox-ygen-free copper box.The module has eight channels,and the output power of each channel is 25 dBm.Each channel has 6-bit phase-shift and 5-bit attenuation.The development results indicate that the module has perfect performance,small size and good heat dissipation,when the module works in the condition of 85℃,the shell temperature can be ensured no more than 90℃,and the re-liability is good while long-term working.