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Stability and leakage characteristics of novel conducting PMOS based 8T SRAM cell

机译:基于PMOS的新型导电8T SRAM单元的稳定性和泄漏特性

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The stability and leakage power of SRAMs have become an important issue with scaling of CMOS technology. This article reports a novel 8-transistor (8T) SRAM cell improving the read and write stability of data storage elements and reducing the leakage current in idle mode. In read operation, the bit-cell keeps the noise-vulnerable data 'low' node voltage close to the ground level and thus producing near-ideal voltage transfer characteristics essential for robust read functionality. In write operation, a negative bias on the cell facilitates to change contents of the bit. Unlike the conventional 6T cell, there is no conflicting read and write requirement on sizing the transistors. In standby mode, the built-in stacked device in the 8T cell reduces the leakage current significantly. The 8T SRAM cell implemented in a 130 nm CMOS technology demonstrates 2× higher read stability while bearing 20% better write-ability at 1.2 V typical condition and a reduction by 45% in leakage power consumption compared to the standard 6T cell. Results of the bit-cell architecture were also compared to the dual-port 8T SRAM cell. The stability enhancement and leakage power reduction provided with the proposed cell are confirmed under process, voltage and temperature variations.
机译:SRAM的稳定性和泄漏功率已成为CMOS技术规模化的重要问题。本文报道了一种新颖的8晶体管(8T)SRAM单元,该单元改善了数据存储元件的读写稳定性并减少了空闲模式下的泄漏电流。在读取操作中,位单元将易受噪声影响的数据“低”节点电压保持在接近地电平的水平,从而产生了对于理想的读取功能至关重要的接近理想的电压传输特性。在写操作中,单元上的负偏压有助于改变该位的内容。与传统的6T单元不同,在晶体管尺寸上没有读写冲突的要求。在待机模式下,8T电池中的内置堆叠式设备可显着降低泄漏电流。与标准6T单元相比,以130 nm CMOS技术实现的8T SRAM单元显示出2倍的更高的读取稳定性,同时在1.2 V典型条件下的写入能力提高了20%,并且泄漏功耗降低了45%。还将位单元架构的结果与双端口8T SRAM单元进行了比较。在工艺,电压和温度变化的情况下,证实了所提出的电池所提供的稳定性增强和泄漏功率降低。

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