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Design and Fabrication of Transparent and Gas-Tight Optical Windows in Low-Temperature Co-Fired Ceramics

机译:低温共烧陶瓷中透明气密光学窗口的设计与制作

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摘要

Low-temperature co-fired ceramics (LTCC) enable the fabrication of microfluidic elements such as channels and embedded cavities in electrical devices. Hence, LTCC facilitate the realization of complex and integrated microfluidic devices. Examples can be applied in many areas like reaction chambers for synthesis of chemical compounds. However, for many applications it is necessary to have an optically transparent interface to the surroundings. The integration of optical windows in LTCC opens up a wide field of new and innovative applications such as the observation of chemiluminescent reactions. These chemical reactions emit electromagnetic radiation and thus offer a method for noninvasive detection. Thin glasses (≤ 500 μm) were bonded by thermocompression onto a LTCC substrate. As the bonding agent, a glass frit paste was used. Borosilicate glasses, fused silica as well as silicon were successfully bonded onto LTCC. To join materials with a large coefficient of thermal expansion mismatch (i.e., fused silica and LTCC), it is necessary to limit the heat input to the bond interface. Therefore, a heating structure was integrated into the LTCC substrate beneath the bond interface. This bonding process provides a gas-tight optical port with a high bond strength.
机译:低温共烧陶瓷(LTCC)使微流控元件的制造成为可能,例如电子设备中的通道和嵌入式腔体。因此,LTCC有助于实现复杂的集成微流体设备。实例可用于许多领域,例如用于合成化合物的反应室。然而,对于许多应用而言,必须具有与周围环境光学透明的界面。光学窗口在LTCC中的集成开辟了许多新的和创新的应用领域,例如化学发光反应的观察。这些化学反应会发出电磁辐射,因此提供了一种非侵入式检测方法。通过热压将薄玻璃(≤500μm)粘合到LTCC基板上。作为粘合剂,使用玻璃粉糊。硼硅酸盐玻璃,熔融石英以及硅已成功粘合到LTCC上。为了接合具有大的热膨胀系数不匹配的材料(即熔融石英和LTCC),必须限制输入到粘结界面的热量。因此,将加热结构整合到键合界面下方的LTCC基板中。该结合过程提供具有高结合强度的气密光学端口。

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    Department of Electronics Technology, Faculty of Electrical Engineering and Information Technology, Institute of Micro- and Nanotechnologies MacroNano~®, Ilmenau University of Technology, 98693 Ilmenau, Germany;

    Department of Electronics Technology, Faculty of Electrical Engineering and Information Technology, Institute of Micro- and Nanotechnologies MacroNano~®, Ilmenau University of Technology, 98693 Ilmenau, Germany,Department of Micromcchanical Systems, Ilmcnau University of Technology , Ilmenau, Germany;

    Department of Electronics Technology, Faculty of Electrical Engineering and Information Technology, Institute of Micro- and Nanotechnologies MacroNano~®, Ilmenau University of Technology, 98693 Ilmenau, Germany;

    Department of Electronics Technology, Faculty of Electrical Engineering and Information Technology, Institute of Micro- and Nanotechnologies MacroNano~®, Ilmenau University of Technology, 98693 Ilmenau, Germany;

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  • 正文语种 eng
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  • 入库时间 2022-08-17 13:39:48

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