Electron Devices Based on GaN and Related Nitride Semiconductors

摘要

State-of-the-art performance and future perspectives of Ill-nitride high-voltage and high-power transistors have been described. The importance of field plate design for achieving optimum high breakdown voltages is discussed based on a two-dimensional numerical device simulation, taking material parameters of the insulating film into account. Simulation results also indicated that an InN or In-rich InGaN channel FET is extremely promising for THz frequency operation. Novel Ⅲ-nitride heterostructures, such as AlInN/InN/AlInN and AlInN/InGaN/AlInN fabricated on non-polar substrates, will provide additional freedom in designing a new device structure that ensures both high current drive capability and high-frequency performance. We predict that millimeter-wave high-power transistors operated at over 60GHz will become more important to establish safe and sustainable society in the future.