The effect of dynamic design processing for yield enhancement in the fabrication of deep sub-micron MOSFET's

摘要

With the downscaling of microelectronic devices, tighter process control and more elaborate fabrication equipment need to be complemented by process correcting techniques if good quality and high yields are to be expected. Dynamic design processing-a forward correcting technique by which some recipe values are recalculated during manufacturing-is such a technique. In this paper the effect of dynamic design processing on deep sub-micron MOSFET's is presented. The results show that a parametric yield improvement in excess of 25% over conventional manufacturing can be achieved.