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Selection Methodology for Si Power MOSFETs Used to Enhance SiC Power MOSFET Short-Circuit Capability With the BaSIC(EMM) Topology

机译:SI功率MOSFET的选择方法,用于增强SIC电源MOSFET短路能力,基本(EMM)拓扑

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The BaSIC(EMM) topology has been previously demonstrated to improve the short-circuit (SC) capability of 1.2-kV SiC power MOSFETs from 3.5 to 7.4 mu s while producing a 17% increase in the net on-state resistance. However, a SC time of 10 mu s could not be achieved. In this article, a systematic procedure for selection of the Si power MOSFET used in the BaSIC(EMM) topology is described based on information published by manufacturers of Si power MOSFETs in their datasheets. A tradeoff curve between the Si EMM drain saturation current at 150 degrees C versus its on-resistance at 25 degrees C is proposed in this article for determination of the best Si EMM product. The proposed methodology allowed identification of a superior Si EMM device. It was experimentally validated that a SC with-stand time of 11 mu s, under a gate bias of 20 V applied to the 1.2-kV SiC power MOSFET at a drain bias of 800 V, was achievable with an increase in on-resistance of only 3.6%. These experimental results demonstrate a greatly improved tradeoff curve between SC time and increase in on-resistance.
机译:先前已经证明了基本(EMM)拓扑,以改善1.2-kV SiC功率MOSFET的短路(SC)能力从3.5到7.4亩,同时产生净导通电阻增加17%。但是,无法实现10亩的SC时间。在本文中,基于SI功率MOSFET在其数据表中发布的信息,描述了用于基于基本(EMM)拓扑中使用的SI功率MOSFET的系统程序。在本文中提出了在本文中提出了在150摄氏度为150摄氏度的饱和电流与其导通电阻之间的折衷曲线。在本文中提出了最佳的SI EMM产品。所提出的方法论允许识别上级SI EMM器件。通过实验验证的是,在施加到1.2-kV SiC功率MOSFET的20V的栅极偏置下,在800V的1.2-kV SiC功率MOSFET的栅极偏置下,可实现导通电阻只有3.6%。这些实验结果表明,SC时间和导通电阻增加之间的折衷曲线。

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