首页> 外国专利> SiC MOSFET SiC MOSFETMANUFACTURING METHOD FOR SiC MOSFET INCLUDING HEAT PROCESSING TREATMENT FOR ENHANCED CRYSTALLINITY OF PILLAR STRUCTURE AND SiC MOSFET MANUFACTURED USING THE SAME

SiC MOSFET SiC MOSFETMANUFACTURING METHOD FOR SiC MOSFET INCLUDING HEAT PROCESSING TREATMENT FOR ENHANCED CRYSTALLINITY OF PILLAR STRUCTURE AND SiC MOSFET MANUFACTURED USING THE SAME

机译:SiC MOSFET的SiC MOSFET的制造方法,包括热处理以增强柱状结构的结晶度,并且使用该方法制造的SiC MOSFET

摘要

The present invention relates to a method for manufacturing a SiC MOSFET capable of filling a trench at a high rate even at room temperature using a particle impact solidification phenomenon, and to a SiC MOSFET manufactured using the method. Specifically, in the present invention, in a method of manufacturing a superjunction (SJ) structure MOSFET, forming a substrate doped with an N-type dopant, forming a drift layer on the substrate, the And forming a trench on the substrate and the drift layer, filling a powder with the formed trench to form a filler, and improving the crystallinity of the formed filler. It relates to a manufacturing method and a MOSFET manufactured using the same.
机译:SiC MOSFET的制造方法及SiC MOSFET技术领域本发明涉及一种即使在室温下也能够利用粒子碰撞固化现象而以较高的速度填充沟槽的SiC MOSFET的制造方法,以及使用该方法制造的SiC MOSFET。具体地,在本发明中,在制造超结(SJ)结构MOSFET的方法中,形成掺杂有N型掺杂剂的衬底,在衬底上形成漂移层,并且在衬底上形成沟槽和漂移层,用形成的沟槽填充粉末以形成填料,并改善形成的填料的结晶度。本发明涉及一种制造方法以及使用该方法制造的MOSFET。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号