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The effects of ionizing radiation on the breakdown voltage of p-channel power MOSFETs

机译:电离辐射对p沟道功率MOSFET击穿电压的影响

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The effects of ionizing radiation on the breakdown voltage of p-channel power MOSFETs were examined through two-dimension simulation. The breakdown-voltage performance of p-channel power MOSFETs was found to be very different from that of corresponding n-channel power MOSFETs. In p-channel devices, simulation showed breakdown-voltage enhancement for low values of positive oxide-trapped charge, N/sub ot/, whereas for high values of N/sub ot/, the breakdown voltage may or may not continue to increase, and may actually decrease in some topologies. For comparison, in n-channel devices, increases in N/sub ot/ always cause breakdown-voltage degradation. The uncertainties stem from the interaction of the depletion region of the device (which is a function of its termination method) with its isolation technology, making it difficult to predict breakdown voltage for large N/sub ot/. However, insights gained through analysis of depletion-region spreading in p-channel devices suggest a termination/isolation scheme, the VLD-FRR, that will enhance p-channel device reliability in radiation environments.
机译:通过二维仿真,研究了电离辐射对p沟道功率MOSFET击穿电压的影响。发现p沟道功率MOSFET的击穿电压性能与相应的n沟道功率MOSFET的击穿电压性能非常不同。在p沟道器件中,仿真显示,对于低值正电荷俘获的电荷N / sub ot /,击穿电压增强,而对于N / sub ot /的高值,击穿电压可能会或可能不会继续增加,并且实际上可能会减少某些拓扑。为了比较,在n沟道器件中,N / sub /的增加总是导致击穿电压下降。不确定性源于器件的耗尽区(取决于其端接方法)与其隔离技术的相互作用,因此难以预测大N / sub /的击穿电压。但是,通过分析p沟道器件中的耗尽区扩展获得的见解表明,端接/隔离方案VLD-FRR将提高辐射环境中p沟道器件的可靠性。

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