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Simulation of SEE-induced charge collection in UHV/CVD SiGe HBTs

机译:SEE诱导的UHV / CVD SiGe HBT中电荷的模拟

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摘要

This paper presents quasi-3-D simulation results of SEE-induced charge collection in UHV/CVD SiGe HBTs. Depending on the bias and load condition, a significant fraction of electrons can be collected by the emitter rather than the collector. Most of the generated holes are collected by the substrate for deep ion strikes, and by the base for shallow ion strikes. A higher substrate doping can worsen the upset of the circuit function, despite the reduced total amount of charge collected. A lower substrate doping and a lower collector-substrate junction reverse bias are desired to improve SEU hardness.
机译:本文介绍了特高压/ CVD SiGe HBT中SEE诱导的电荷收集的准3-D模拟结果。根据偏置和负载条件,大部分电子可以由发射器而不是集电极收集。大多数产生的空穴被衬底收集以用于深离子轰击,并被基底收集以用于浅离子轰击。尽管收集的电荷总量减少,但较高的基板掺杂量可能会使电路功能恶化。需要较低的衬底掺杂和较低的集电极-衬底结反向偏压以改善SEU硬度。

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