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Neutron-Induced Soft Errors and Multiple Cell Upsets in 65-nm 10T Subthreshold SRAM

机译:65nm 10T亚阈值SRAM中的中子引起的软错误和多单元不安

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摘要

In this paper, the soft error rate (SER) induced by neutrons in 65-nm 10T static random access memory (SRAM) is measured over a wide range of supply voltages from 1.0 to 0.3 V. The results show that the neutron-induced SER at 0.3 V is around eight times that at 1.0 V. The dependence of multiple cell upsets (MCUs) on the supply voltage and on the distance between well ties is also investigated. The dependence of the MCU rate on the supply voltage between 1.0 and 0.5 V is small and increases as the voltage is reduced below 0.5 V. This is because the effect of another mechanism, such as charge-sharing, becomes larger in the subthreshold region, rather than the parasitic bipolar effect, which is considered the dominant mechanism causing MCUs in SRAM at the nominal supply voltage in our design.
机译:在本文中,在1.0至0.3 V的宽电源电压范围内,测量了中子在65 nm 10T静态随机存取存储器(SRAM)中引起的软错误率(SER)。结果表明,中子引起的SER在0.3 V时的电压大约是1.0 V时的8倍。还研究了多个电池不正常工作(MCU)对电源电压和孔之间距离的依赖性。 MCU速率对1.0至0.5 V之间电源电压的依赖性很小,并且随着电压降低至0.5 V以下而增加。这是因为在阈值以下区域,电荷共享等其他机制的影响变得更大,而不是寄生双极效应,在我们的设计中,寄生双极效应被认为是导致标称电源电压下SRAM中的MCU的主要机制。

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