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Power performance of InP-based single and double heterojunction bipolar transistors

机译:基于InP的单和双异质结双极晶体管的功率性能

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The microwave and power performance of fabricated InP-based single and double heterojunction bipolar transistors (HBTs) is presented. The single heterojunction bipolar transistors (SHBTs), which had a 5000 /spl Aring/ InGaAs collector, had BV/sub CEO/ of 7.2 V and J/sub Cmax/ of 2/spl times/10/sup 5/ A/cm/sup 2/. The resulting HBTs with 2/spl times/10 /spl mu/m/sup 2/ emitters produced up to 1.1 mW//spl mu/m2 at 8 GHz with efficiencies over 30%. Double heterojunction bipolar transistors (DHBTs) with a 3000-/spl Aring/ InP collector had a BV/sub CEO/ of 9 V and J/sub c max/ of 1.1/spl times/10/sup 5/ A/cm/sup 2/, resulting in power densities up to 1.9 mW//spl mu/m/sup 2/ at 8 GHz and a peak efficiency of 46%. Similar DHBTs with a 6000 /spl Aring/ InP collector had a higher BV/sub CEO/ of 18 V, but the J/sub c max/ decreased to 0.4/spl times/10/sup 5/ A/cm/sup 2/ due to current blocking at the base-collector junction. Although the 6000 /spl Aring/ InP collector provided higher f/sub max/ and gain than the 3000 /spl Aring/ collector, the lower J/sub c max/ reduced its maximum power density below that of the SHBT wafer. The impact on power performance of various device characteristics, such as knee voltage, breakdown voltage, and maximum current density, are analyzed and discussed.
机译:介绍了基于InP的单双异质结双极晶体管(HBT)的微波性能和功率性能。具有5000 / spl Aring / InGaAs集电极的单异质结双极晶体管(SHBT)的BV / sub CEO /为7.2 V,J / sub Cmax /为2 / spl次/ 10 / sup 5 / A / cm / sup 2 /。所产生的HBT的2 / spl次/ 10 / spl mu / m / sup 2 /个发射器在8 GHz时产生高达1.1 mW // spl mu / m2的效率,效率超过30%。具有3000- / spl Aring / InP集电极的双异质结双极晶体管(DHBT)的BV / sub CEO /为9 V,J / sub c max /为1.1 / spl次/ 10 / sup 5 / A / cm / sup 2 /,导致功率密度在8 GHz时高达1.9 mW // spl mu / m / sup 2 /,峰值效率为46%。具有6000 / spl Aring / InP收集器的类似DHBT具有更高的BV / sub CEO / 18 V,但J / sub c max /降至0.4 / spl次/ 10 / sup 5 / A / cm / sup 2 /由于基极-集电极结处的电流阻塞。尽管6000 / spl Aring / InP收集器提供的f / sub max /和增益高于3000 / spl Aring /收集器,但较低的J / sub cmax /却将其最大功率密度降低到SHBT晶片以下。分析和讨论了各种器件特性(例如拐点电压,击穿电压和最大电流密度)对功率性能的影响。

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