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The Improvement of High-$k$/Metal Gate pMOSFET Performance and Reliability Using Optimized Si Cap/SiGe Channel Structure

机译:通过优化的Si Cap / SiGe沟道结构改善高$ k $ /金属栅极pMOSFET的性能和可靠性

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The impact of the Si cap/SiGe layer on the Hf-based high-$k$ /metal gate SiGe channel pMOSFET performance and reliability has been investigated. We proposed an optimized strain SiGe channel with a Si cap layer to overcome the Ge diffusion and confine the channel carriers in the strained SiGe layer without the formation of a significant parasitic channel at the interface. With this optimized Si/SiGe stack channel, a high-performance Hf-based high-$k$/metal gate SiGe pMOSFET can be obtained with an appropriate $V_{rm TH}$ ( $sim$0.3 V), low $C$ –$V$ hysteresis ( $<$ 5 mV), and better $I_{rm ON} - I_{rm OFF}$ , $V_{rm TH}$ rolloff, and $V_{rm TH}$ stability. By the way, the related interface trap density in the high-$k$ gate stack layer can also be reduced, thus improving the device's NBTI and HCI stressing-induced reliability.
机译:研究了Si盖层/ SiGe层对基于Hf的高k $ /金属栅SiGe沟道pMOSFET性能和可靠性的影响。我们提出了一种具有Si盖层的优化应变SiGe沟道,以克服Ge扩散并将沟道载流子限制在应变SiGe层中,而不会在界面处形成明显的寄生沟道。利用此优化的Si / SiGe堆栈通道,可以通过适当的$ V_ {rm TH} $($ sim $ 0.3 V),低$ C $获得高性能,基于H的高k $ /金属栅极SiGe pMOSFET。 – $ V $的磁滞($ <$ 5 mV),以及更好的$ I_ {rm ON}-I_ {rm OFF} $,$ V_ {rm TH} $下降和$ V_ {rm TH} $稳定性。顺便说一句,高$ k $栅堆叠层中的相关界面陷阱密度也可以降低,从而提高了器件的NBTI和HCI应力诱导的可靠性。

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