首页> 外文期刊>IEEE transactions on device and materials reliability >Temporally- and Spatially-Resolved Observations of Current Filament Dynamics in Insulated Gate Bipolar Transistor Chip During Avalanche Breakdown
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Temporally- and Spatially-Resolved Observations of Current Filament Dynamics in Insulated Gate Bipolar Transistor Chip During Avalanche Breakdown

机译:在雪崩击穿期间绝缘栅极双极晶体管芯片中电流灯丝动力学的时间和空间分辨观察

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Two-dimensional imaging of the dynamics of current filaments generated in Insulated Gate Bipolar Transistor (IGBT) chip at room temperature during avalanche breakdown has been performed. The images were obtained by using the Hamamatsu TriPHEMOS equipped with the micro-channel plate (MCP) sensor. The equipment can operate in single photon counting mode. From obtained image series, at the beginning of the avalanche breakdown, the emission intensity at the corners in the edge termination region of the IGBT was found to be high. The pixels with high emission intensity of these corners moved to the center of the four sides of the IGBT shape in the latter half of the avalanche breakdown period. Assuming that these pixels with high emission intensity are attributable to the current filament, it shows that the current filaments are moving at a speed of about 0.9 mm/mu s.
机译:已经进行了在雪崩击穿期间在室温下绝缘栅双极晶体管(IGBT)芯片中产生的电流长丝动力学的二维成像。通过使用配备有微通道板(MCP)传感器的Hamamatsu Triphemos获得了图像。设备可以以单光子计数模式运行。从获得的图像系列,在雪崩击穿开始时,发现IGBT的边缘端接区域的角落处的发光强度很高。具有高发射强度的像素在雪崩击穿时段的后半部分中移动到IGBT形状的四边的中心。假设具有高发射强度的这些像素可归因于当前灯丝,所以它表明电流长丝以约0.9mm / mm的速度移动。

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