机译:具有8 T SRAM单元和数据相关写入辅助功能的32 kb 0.35–1.2 V,50 MHz–2.5 GHz比特交错SRAM,采用28nm UTBB-FDSOI CMOS
STMicroelectronics, Noida, India;
IIIT Delhi, New Delhi, India;
STMicroelectronics, Noida, India;
STMicroelectronics, Noida, India;
STMicroelectronics, Crolles, France;
CEA-LETI, MINATEC, Grenoble, France;
CEA-LETI, MINATEC, Grenoble, France;
CEA-LETI, MINATEC, Grenoble, France;
CEA-LETI, MINATEC, Grenoble, France;
CEA-LETI, MINATEC, Grenoble, France;
STMicroelectronics, Crolles, France;
STMicroelectronics, Noida, India;
STMicroelectronics, Noida, India;
SRAM cells; Low voltage; Circuit stability; Layout; Logic gates;
机译:使用写入和读取辅助技术的低VMIN应用的28nm 32Kb SRAM
机译:1 ns,1 W,2.5 V,32 Kb NTL-CMOS SRAM宏,使用带有PMOS存取晶体管的存储单元
机译:适用于太阳能供电的便携式个人数字设备的0.5V 25MHz 1-mW 256Kb MTCMOS / SOI SRAM-使用降压负过驱动位线方案确保写入操作
机译:一个16kB可拼接的SRAM宏原型,用于28nm HKMG CMOS的工作频率范围为4.8GHz(1.12V VDD)至10MHz(0.5V)
机译:采用写和读辅助技术的低VMIN应用的28nm 32Kb SRAM