2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications

摘要

Heterogeneously integrated and miniaturized neural sensing microsystems are crucial for brain function investigation. In this paper, a 2.5D heterogeneously integrated bio-sensing microsystem with -probes and embedded through-silicon-via (TSVs) is presented for high-density neural sensing applications. This microsystem is composed of -probes with embedded TSVs, 4 dies and a silicon interposer. For capturing 16-channel neural signals, a 24 24 -probe array with embedded TSVs is fabricated on a chip and bonded on the back side of the interposer. Thus, each channel contains 6 6 -probes with embedded TSVs. Additionally, the 4 dies are bonded on the front side of the interposer and designed for biopotential acquisition, feature extraction and classification via low-power analog front-end (AFE) circuits, area-power-efficient analog-to-digital converters (ADCs), configurable discrete wavelet transforms (DWTs), filters, and a MCU. An on-interposer bus (-SPI) is designed for transferring data on the interposer. Finally, the successful in-vivo test demonstrated the proposed 2.5D heterogeneously integrated bio-sensing microsystem. The overall power of this microsystem is only 676.3 for 16-channel neural sensing.