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Band Pass Filter for 2.5D/3D Integrated Circuit Applications
Band Pass Filter for 2.5D/3D Integrated Circuit Applications
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机译:适用于2.5D / 3D集成电路应用的带通滤波器
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摘要
The present disclosure relates to a device and method for a band pass filter with a reduced cost, area penalty, and manufacturing complexity relative to current solutions. An integrated passive device chip comprising a plurality of capacitors embedded in a common molding compound along with a transceiver chip, and arranged within a polymer package. Ultra-thick metallization layers are disposed within the polymer package and configured to couple the integrated passive device chip to the transceiver chip. The ultra-thick metallization layers also form a plurality of transmission lines, wherein the combined integrated passive device chip and transmission lines form a band pass filter with improved frequency response, noise immunity, and cost and area penalty as compared to conventional solutions. The band pass filter may also be coupled to a plurality of solder balls comprising a Flip Chip Ball Grid Array suitable for 2.5D and 3D integrated circuit applications.
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