Pushing the Envelope for Heterogeneity: Multilayer and 3-D Heterogeneous Integrations for Next Generation Millimeter- and Submillimeter-Wave Circuits and Systems

摘要

Millimeter-wave (mmW) and submillimeter-wave (sub-mmW) or terahertz (THz; >300 GHz) frequencies are receiving increasing interest due to their distinct advantages, such as wider bandwidth, higher spatial (size) and temporal (time) resolution, the more compact antennas and other components they allow, and the reusability of frequencies [1], [2]. As a result, both military and commercial applications in areas of high-speed wireless communication [including fifth-generation (5G), i.e., 38 GHz and 68 GHz, 81-86 GHz, and 92?95 GHz], defense, security, and space science have been increasing rapidly [3], [4]. In recent years, mmW and THz applicaitons for spectroscopy and imaging, astronomy, and environmental/atmospheric study and monitoring have grown exponentially as advanced techniques [5]. At the same time, mmW/THz imaging is being viewed as a safe, low-cost alternative to conventional techniques for biological, security, and health-sciences applications [6], [7].