PROCESS FOR PRODUCING A CIRCUITRY COMPRISING CONDUCTING TRACKS PADS AND MICROVIAS THE USE OF THIS PROCESS FOR THE PRODUCTION OF PRINTED CIRCUITS AND OF MULTILAYER MODULES HAVING A HIGH INTEGRATION DENSITY CIRCUITS USING THE SAME AND PRINTED CIRCUITS AND MULTILAYER MODULES HAVING THE CIRCUITS USING THE SAME

摘要

PURPOSE: A process for producing a circuitry comprising conducting tracks, pads and microvias, the use of this process for the production of printed circuits and of multilayer modules having a high integration density, circuits using the same, and printed circuits and multilayer modules having the circuits using the same are provided to attach copper on the dielectric surface fixedly and achieve a small size microvias. CONSTITUTION: In a method for making a circuitry comprising conductive tracks, chips and micro-vias, at the top surface of a dielectric(303) consisting of a polymer matrix, a compound capable of inducing subsequent metallization and, if required one or several non-conductive and inert fillers, the dielectric(303) covering a level of circuitry(302) or metalized layer, which comprises steps which consist in perforating right through the dielectric(303) without perforating the subjacent metalized layer or the subjacent level of circuitry(302), so as to form one or several micro-vias at desired sites, forming, by metallization, metal tracks, chips and micro-vias at the surface of the dielectric and of the micro-vias, while providing selective protection by depositing a protective layer.