机译:异构3D电路:将自由空间光学器件与CMOS集成
Drexel Univ, Dept Elect & Comp Engn, 3120-40 Market St,Bossone 313 Off 610, Philadelphia, PA 19104 USA;
Univ Rochester, Inst Opt, Rochester, NY 14627 USA;
Univ Rochester, Inst Opt, Rochester, NY 14627 USA;
Univ Rochester, Inst Opt, Rochester, NY 14627 USA;
Univ Rochester, Inst Opt, Rochester, NY 14627 USA;
Univ Rochester, Inst Opt, Rochester, NY 14627 USA;
Univ Rochester, Inst Opt, Rochester, NY 14627 USA;
Univ Rochester, Inst Opt, Rochester, NY 14627 USA;
Univ Rochester, Inst Opt, Rochester, NY 14627 USA;
Univ Rochester, Inst Opt, Rochester, NY 14627 USA;
Univ Rochester, Dept Elect & Comp Engn, 601 Elmwood Ave, Rochester, NY 14627 USA;
Univ Rochester, Dept Elect & Comp Engn, 601 Elmwood Ave, Rochester, NY 14627 USA;
Univ Rochester, Dept Elect & Comp Engn, 601 Elmwood Ave, Rochester, NY 14627 USA;
3-D IC; Free-space optical networks; Optical interconnects; Heterogeneous 3-D ICs;
机译:有源亚微米CMOS电路上的MQW调制器的3-D集成:375 Mb / s跨阻收发器电路
机译:3-D顺序集成:一项新功能与CMOS异构异构集成的关键支持技术
机译:用于低功耗3D系统集成的CMOS电感耦合链路中缓解电源/信号线和SRAM电路干扰的分析和技术
机译:异构BiCMOS技术和电路以及DARPA多样可访问异构集成(DAHI)程序
机译:AlN MEMS轮廓模式谐振器和CMOS电路的异构集成
机译:超越CMOS:III-V器件RF MEMS和其他异种材料/器件与Si CMOS的异构集成以创建智能微系统
机译:通过INP HBT和Si CMOS在硅衬底上的直接单片异构集成使能高性能混合信号电路