Microsectioning: A Metallographic Technique for Semiconductor Devices

摘要

A microsectioning technique is described that enables metallographic sectioning of fragile semiconductor devices without the difficulties and specimen damage associated with the use of conventional techniques. Major advantages are (a) maintenance of a planar surface on specimens having adjoining areas of widely varying physical characteristics, (b) preservation of boundary details between such areas by elimination of rounding-off effects, and (c) precise positioning of the sectioning plane by direct micrometer caliper measurement. Choice of sectioning plane, specimen mounting, machine lapping of mounted specimens, polishing, etching, and panoramic microphotographic techniques are described. The effectiveness with which data can be gathered from the resulting microphotographs is demonstrated by an analysis and evaluation of selected specimen photographs.