The metallographic examination of semiconductor devices

摘要

A technique for preparing microsections of semiconductor devices is described. The use of diamond lapping compounds for polishing enables flat sections of all the components of a device to be produced. Details are given of the recommended techniques for cutting, mounting, polishing and etching of specimens. In order to illustrate the potentialities of the method for both research and routine inspection, a selection of photomicrographs of various semiconductor devices is presented.