The demand for a quarter-micron level process technology that can achieve higher precision, higher quality, thinner bonding, and which can accommodate smaller lead sizes and thinner films is rising. At the same time there is a need for thermal process equipment that supports automation, larger diameters, small-log multi-type production, reduction of development and prototype production time, and such aspects of economy as reduced equipment investment costs. To meet these needs, Hitachi has developed a single-wafer thermal processing system that offers high cost performance. The new technology consists of a resistance-heating hot-wall system that features uniform temperature, a long-life heater, low-power consumption, high-precision, high-throughput, high-reliability, low-running cost, ease of maintenance, support for computer-integrated production, and support for multiple batch processing. With this new system, it has been possible to increase both precision (uniformity of film thickness) and throughput to levels twice that of conventional equipment.
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