Method of cooling a process chamber of the single-wafer thermal processing apparatus

摘要

PROBLEM TO BE SOLVED: To reduce slip dislocation occurring from a support position of a support pin.;SOLUTION: In a method of cooling a process chamber 11 provided to a sheet type heat treatment apparatus 10 by blowing a cooling gas 14 to the process chamber 11 while or after heating a single silicon wafer 13 supported horizontally with a plurality of support pins 12, the flow rate of the cooling gas 14 blown to an upper surface of the process chamber 11 is 0.471 to 0.754 liter/min-cm² and a flow rate of the cooling gas 14 blown to an under surface of the process chamber 11 is 0 to 0.038 liter/min-cm².;COPYRIGHT: (C)2010,JPO&INPIT