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Leakage mechanisms in the trench transistor DRAM cell

机译:沟槽晶体管DRAM单元中的泄漏机制

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The authors discuss a band-to-band tunneling mechanism in the trench transistor cell (TTC), which is used in Texas Instruments' 4-Mbit DRAM. This effect should be operative in the class of trench cells in which the charge is stored inside the trench and the substrate forms a capacitor plate. This effect does not compromise the functionality of the cell; in fact, it has the potential of improving the long-term reliability of the cell by preventing electrical overstress of the trench capacitor oxide.
机译:作者讨论了在德州仪器(Texas Instruments)的4 Mbit DRAM中使用的沟槽晶体管单元(TTC)中的带间隧穿机制。这种效果应在其中电荷存储在沟槽内且基板形成电容器极板的沟槽单元中起作用。这种效果不会损害电池的功能。实际上,它具有通过防止沟槽电容器氧化物的电过应力来改善电池的长期可靠性的潜力。

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