The authors present an overview of various single-wafer fabrication techniques for integrated processing of microelectronic devices. Numerous processing modules, sensors, and associated fabrication processes have been developed for advanced semiconductor device manufacturing. The combination of single-wafer processing, cluster tools, sensors, and advanced factory control/computer-integrated manufacturing techniques provides a capability for flexible fast-cycle-time device manufacturing. Specific developments and results are described in the areas of dry/vapor-phase surface cleaning, epitaxy, plasma processing, rapid thermal processing, and in situ sensors. An integrated sub-half micrometer CMOS technology based on these single-wafer fabrication methods including rapid thermal processing is also described.
展开▼
