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Application of selective epitaxial silicon and chemo-mechanical polishing to bipolar transistors

机译:选择性外延硅和化学机械抛光在双极晶体管中的应用

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Successful demonstration of single-polysilicon bipolar transistors fabricated using selective epitaxial growth (SEG) and chemo-mechanical polishing (CMP) is reported. The pedestal structure made possible by the SEG/CMP process combination results in significantly reduced extrinsic-base collector capacitance. Cut-off frequency (f/sub T/) of devices with emitter stripe width of 1 /spl mu/m, a base width of 110 nm, and a peak base doping of 3/spl times/10/sup 18/ cm/sup -3/ have been observed to improve from 16 GHz to 22 GHz when the extrinsic-base collector overlap is decreased from 1 /spl mu/m to 0.2 /spl mu/m. Leakage current, often a problem for SEG structures, has been reduced to 27 nA/cm/sup 2/ for the area component, and 10 nA/cm for the edge component, by (1) appropriate post-polish processing, including a high-temperature anneal and sacrificial oxidation, (2) aligning the device sidewalls along the >100< direction, and (3) the presence of the pedestal structure. Base-emitter junction nonideality in these transistors has also been investigated.
机译:报道了使用选择性外延生长(SEG)和化学机械抛光(CMP)制造的单多晶硅双极晶体管的成功演示。 SEG / CMP工艺组合使基座结构成为可能,从而大大降低了非本征基极的集电极电容。发射极条纹宽度为1 / spl mu / m,基极宽度为110 nm,峰值基极掺杂为3 / spl次/ sup 18 / cm /的器件的截止频率(f / sub T /)当非本征基极收集器的重叠从1 / spl mu / m降低到0.2 / spl mu / m时,已观察到sup -3 /从16 GHz改善到22 GHz。通过(1)适当的后抛光处理(包括高电流),泄漏电流(对于SEG结构而言通常是一个问题)已被减小为面积分量的27 nA / cm / sup 2 /和边缘分量的10 nA / cm。 -温度退火和牺牲氧化;(2)沿> 100 <方向对齐设备侧壁,以及(3)存在基座结构。还研究了这些晶体管中的基极-发射极结非理想性。

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