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Low-temperature characteristics of well-type guard rings in epitaxial CMOS

机译:外延CMOS中的阱型保护环的低温特性

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Characterization and simulation of minority-carrier well-type guard rings in epitaxial substrate at 77 K were performed and compared with those at RT. The escape probability in a narrow guard-ring structure under the same amount of minority carrier injection increases by about one order of magnitude when temperature decreases to 77 K. This degradation in the guard-ring efficiency can be attributed to the enhanced drift mechanism in the conductivity-modulated layer between the well bottom junction and the epitaxial high/low junction at 77 K. In contrast, this mechanism enhances the width dependence of the escape probability at 77 K. The higher minority-carrier recombination velocity of the epitaxial high-low junction contributes to the stronger width dependence secondarily. When the epitaxial layer thickness becomes thinner, the simulation also demonstrates a stronger width dependence of the escape current as well as a reduction in its magnitude. A lightly-doped epitaxial layer on a heavily-doped substrate exhibits even more importance in the guard ring efficiency for low temperature operation, and its thickness should be kept as thin as possible.
机译:在外延衬底中,在77 K下对少数载流子阱型保护环进行了表征和仿真,并与RT下的进行了比较。当温度降至77 K时,在相同的少数载流子注入量下,狭窄的保护环结构中的逸出几率增加了大约一个数量级。保护环效率的这种下降可归因于增强的漂移机制。阱底部结和外延高/低结之间在77 K时的电导率调制层。相比之下,此机制增强了77 K时逸出概率的宽度依赖性。外延高-低杂散载子复合速度较高其次,结点对宽度的依赖性更强。当外延层的厚度变得更薄时,该模拟还证明了逃逸电流的宽度依赖性更强,并且其幅度减小。重掺杂衬底上的轻掺杂外延层在低温操作的保护环效率上表现出更大的重要性,并且其厚度应保持尽可能薄。

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