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Two-dimensional doping profile characterization of MOSFETs by inverse modeling using I-V characteristics in the subthreshold region

机译:使用亚阈值区域中的I-V特性通过反向建模对MOSFET进行二维掺杂轮廓表征

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In this paper, we present a new technique for the characterization of two-dimensional (2-D) doping profiles in deep submicron MOSFETs using current-voltage (I-V) characteristics in the subthreshold region. The main advantages of the technique are as follows. (1) It is capable of extracting 2-D doping profile (including channel-length) of deep submicron devices because of its immunity to parasitic resistance, capacitance, noise, and fringing electric fields. (2) It does not require any special test structures since only subthreshold I-V data are used. (3) It is nondestructive. (4) It has very little dependence on mobility and mobility models. (5) It is easy to use since data collection and preparation are straightforward. (6) It can be extended to the accurate calibration of mobility and mobility models using I-V characteristics at high current levels, because errors associated with uncertainties in doping profiles are removed.
机译:在本文中,我们提出了一种使用亚阈值区域中电流-电压(I-V)特性表征深亚微米MOSFET中二维(2-D)掺杂分布的新技术。该技术的主要优点如下。 (1)由于其对寄生电阻,电容,噪声和边缘电场的抵抗力,因此能够提取深亚微米器件的二维掺杂分布图(包括沟道长度)。 (2)由于仅使用亚阈值I-V数据,因此不需要任何特殊的测试结构。 (3)无损。 (4)它几乎不依赖于流动性和流动性模型。 (5)易于使用,因为数据收集和准备非常简单。 (6)由于可以消除与掺杂分布不确定性相关的误差,因此可以扩展到使用I-V特性在高电流水平下对迁移率和迁移率模型进行精确校准。

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