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Effects of wet oxidation/anneal on interface properties of thermally oxidized SiO/sub 2//SiC MOS system and MOSFET's

机译:湿氧化/退火对热氧化SiO / sub 2 // SiC MOS系统和MOSFET界面性能的影响

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Effects of wet atmosphere during oxidation and anneal on thermally oxidized p-type and n-type MOS interface properties were systematically investigated for both 4H- and 6H-SiC. Deep interface states and fixed oxide charges were mainly discussed. The wet atmosphere was effective to reduce a negative flatband shift caused by deep donor-type interface states in p-type SiC MOS capacitors. Negative fixed charges, however, appeared near the interface during wet reoxidation anneal. In n-type SIC MOS capacitors, the flatband shift indicated a positive value when using wet atmosphere. The relation between interface properties and characteristics of n-channel planar 6H-SiC metal-oxide-semiconductor field effect transistors (MOSFETs) was also investigated. There was little relation between the interface properties of p-type MOS capacitors and the channel mobility of MOSFETs. The threshold voltage of MOSFETs processed by wet reoxidation anneal was higher than that of without reoxidation anneal. A clear relation between the threshold voltage and the channel mobility was observed in MOSFETs fabricated on the same substrate.
机译:对于4H-和6H-SiC,系统地研究了氧化和退火过程中湿气氛对热氧化p型和n型MOS界面性能的影响。主要讨论了深界面态和固定氧化物电荷。湿润的气氛可以有效地减少由p型SiC MOS电容器中深施主型界面态引起的负平带偏移。但是,在湿式再氧化退火过程中,界面附近会出现负的固定电荷。在n型SIC MOS电容器中,使用潮湿环境时的平带偏移表示正值。还研究了n沟道平面6H-SiC金属氧化物半导体场效应晶体管(MOSFET)的界面特性与特性之间的关系。 p型MOS电容器的界面特性与MOSFET的沟道迁移率之间几乎没有关系。通过湿式再氧化退火处理的MOSFET的阈值电压高于未进行再氧化退火的MOSFET的阈值电压。在同一衬底上制造的MOSFET中,观察到了阈值电压与沟道迁移率之间的明确关系。

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