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Simulation of oxide trapping noise in submicron n-channel MOSFETs

机译:亚微米n沟道MOSFET中氧化物俘获噪声的仿真

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Carrier trapping via tunneling into the gate oxide was implemented into a partial differential equation-based semiconductor device simulator to analyze the 1/f-like noise in silicon MOSFETs. Local noise sources are calculated using the carrier tunneling rates between trap centers in the oxide and those at the interface. Using the Green's transfer function approach, noise contributions from each node in the oxide mesh to the overall noise at the specified contact terminals are simulated. Unlike traditional 1/f noise analyses in MOSFETs, the simulator is capable of simulating noise for a wide range of bias voltages and device structures. The simulation results show that for an uniformly doped channel, the region in the oxide above the pinch-off point in saturation is most critical for low frequency noise generation while for a graded channel device the source side of the gate oxide region becomes important. By comparing the simulation results with the measured noise data, the oxide defect density in the noise producing regions can be profiled.
机译:通过隧穿进入栅极氧化物的载流子捕获被实现到基于偏微分方程的半导体器件仿真器中,以分析硅MOSFET中的1 / f类噪声。使用氧化物中陷阱中心和界面陷阱中心之间的载流子隧穿速率来计算局部噪声源。使用格林的传递函数方法,模拟了氧化物网格中每个节点对指定接触端子处的总体噪声的噪声影响。与MOSFET中传统的1 / f噪声分析不同,该仿真器能够仿真各种偏置电压和器件结构的噪声。仿真结果表明,对于均匀掺杂的沟道,饱和区中夹点以上的氧化物中的区域对于产生低频噪声最为关键,而对于渐变沟道器件而言,栅极氧化物区域的源极至关重要。通过将模拟结果与测得的噪声数据进行比较,可以分析出噪声产生区域中的氧化物缺陷密度。

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