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首页> 外文期刊>IEEE Transactions on Electron Devices >Influence of the Dynamic Access Resistance in the g{sub}m and f{sub}T Linearity of AlGaN/GaN HEMTs
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Influence of the Dynamic Access Resistance in the g{sub}m and f{sub}T Linearity of AlGaN/GaN HEMTs

机译:动态访问电阻对AlGaN / GaN HEMT的g {sub} m和f {sub} T线性的影响

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摘要

The decrease of transconductance g{sub}m and current gain cutoff frequency f{sub}T at high drain current levels in AlGaN/GaN high-electron mobility transistors (HEMTs) severely limits the linearity and power performance of these devices at high frequencies. In this paper, the increase of the differential source access resistance r{sub}s, with drain current is shown to play an important role in the fall of g{sub}m and f{sub}T. The increase of r{sub}s occurs due to the quasi-saturation of the electron velocity in the source region of the channel at electric fields higher than 10 kV/cm. This has been confirmed by both experimental measurements and two-dimensional drift-diffusion simulations. Through simulations, we have identified HEMT structures with source implanted regions (or n{sup}(++) cap layers) as good candidates in order to increase the linearity of the g{sub}m and f{sub}T versus current profile.
机译:在AlGaN / GaN高电子迁移率晶体管(HEMT)中,在高漏极电流水平下,跨导g {sub} m和电流增益截止频率f {sub} T的降低严重限制了这些器件在高频下的线性和功率性能。在本文中,随着漏电流的增加,差分源访问电阻r {sub} s的增加在g {sub} m和f {sub} T的下降中起着重要作用。 r {sub} s的增加是由于在高于10 kV / cm的电场下通道的源区中电子速度的准饱和而引起的。这已通过实验测量和二维漂移扩散模拟得到了证实。通过仿真,我们确定了具有源注入区(或n {sup}(++)盖层)的HEMT结构为良好的候选方案,以增加g {sub} m和f {sub} T与电流分布的线性关系。

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