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首页> 外文期刊>IEEE Transactions on Electron Devices >Leakage Power Analysis of 25-nm Double-Gate CMOS Devices and Circuits
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Leakage Power Analysis of 25-nm Double-Gate CMOS Devices and Circuits

机译:25nm双栅极CMOS器件和电路的泄漏功率分析

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摘要

Leakage power and input pattern dependence of leakage for extremely scaled (L{sub}(eff) = 25 nm) double-gate (DG) circuits are analyzed, compared with those of conventional bulk-Si counterpart. Physics-based numerical two-dimensional simulation results for DG CMOS device/circuit power are presented, identifying that DG technology is an ideal candidate for low-power applications. Unique DG device features resulting from gate-gate coupling are discussed and effectively exploited for optimal low-leakage device design. Design tradeoffs for DG CMOS power and performance are suggested for low-power and high-performance applications. Total power consumptions of static and dynamic circuits and latches for DG device, considering state dependency, show that leakage currents for DG circuits are reduced by a factor of over 10×, compared with bulk-Si counterpart.
机译:与传统的体硅晶体管相比,分析了超大规模(L {sub}(eff)= 25 nm)双栅极(DG)电路的泄漏功率和泄漏的输入模式依赖性。提出了基于物理的DG CMOS器件/电路功率的二维数值模拟结果,表明DG技术是低功率应用的理想选择。讨论并有效利用了栅极-栅极耦合产生的DG设备的独特功能,以实现最佳的低泄漏器件设计。对于低功率和高性能应用,建议对DG CMOS功率和性能进行设计折衷。考虑到状态相关性,DG设备的静态和动态电路以及锁存器的总功耗表明,与体硅晶体管相比,DG电路的泄漏电流降低了10倍以上。

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