首页> 外文期刊>IEEE Transactions on Electron Devices >A novel high-/spl kappa/ SONOS memory using TaN/Al/sub 2/O/sub 3//Ta/sub 2/O/sub 5//HfO/sub 2//Si structure for fast speed and long retention operation
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A novel high-/spl kappa/ SONOS memory using TaN/Al/sub 2/O/sub 3//Ta/sub 2/O/sub 5//HfO/sub 2//Si structure for fast speed and long retention operation

机译:使用TaN / Al / sub 2 / O / sub 3 // Ta / sub 2 / O / sub 5 // HfO / sub 2 // Si结构的新型高/ spl kappa / SONOS存储器,可实现快速的速度和长的保留操作

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A novel high-/spl kappa/ silicon-oxide-nitride-oxide-silicon (SONOS)-type memory using TaN/Al/sub 2/O/sub 3//Ta/sub 2/O/sub 5//HfO/sub 2//Si (MATHS) structure is reported for the first time. Such MATHS devices can keep the advantages of our previously reported TaN/HfO/sub 2//Ta/sub 2/O/sub 5//HfO/sub 2//Si device structure to obtain a better tradeoff between long retention and fast programming as compared to traditional SONOS devices. While at the same time by replacing hafnium oxide (HfO/sub 2/) with aluminum oxide (Al/sub 2/O/sub 3/) for the top blocking layer, better blocking efficiency can be achieved due to Al/sub 2/O/sub 3/'s much larger barrier height, resulting in greatly improved memory window and faster programming. The fabricated devices exhibit a fast program and erase speed, excellent ten-year retention and superior endurance up to 10/sup 5/ stress cycles at a tunnel oxide of only 9.5 /spl Aring/ equivalent oxide thickness.
机译:使用TaN / Al / sub 2 / O / sub 3 // Ta / sub 2 / O / sub 5 // HfO /的新型高/ spl kappa /氧化硅-氮化物-氧化硅(SONOS)型存储器sub 2 // Si(MATHS)结构是首次报道。这样的MATHS器件可以保持我们先前报道的TaN / HfO / sub 2 // Ta / sub 2 / O / sub 5 // HfO / sub 2 // Si器件结构的优势,从而在长保留和快速编程之间获得更好的权衡与传统的SONOS设备相比。虽然同时用氧化铝(Al / sub 2 / O / sub 3 /)代替氧化ha(HfO / sub 2 /)作为顶部阻挡层,但由于Al / sub 2 /可以实现更好的阻挡效率O / sub 3 /的势垒高度大得多,从而大大改善了内存窗口并加快了编程速度。所制造的器件在仅9.5 / spl Aring /等效氧化物厚度的隧道氧化层中表现出快速的编程和擦除速度,出色的十年保持性以及高达10 / sup 5 /应力循环的出色耐久性。

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