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Modeling of Vth Shift in nand Flash-Memory Cell Device Considering Crosstalk and Short-Channel Effects

机译:考虑串扰和短通道效应的nand闪存单元器件的Vth漂移建模

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A threshold-voltage $(V_{rm th})$ shift of sub-100-nm nand Flash-memory cell transistors was modeled systematically, and the modeling was verified by comparing with the data from measurement and 3-D device simulation. The $V_{rm th}$ shift of the nand Flash-memory cell was investigated by changing parameters such as gate length, width, drain voltage, dielectric material between cells, space between cells, lightly doped-drain depth, and adjacent-cell bias. The proposed model covers two dominant device physics: capacitance coupling effect between adjacent cells and short-channel effect. Our model showed an accurate prediction of the $V_{rm th}$ shift of nand Flash-memory array and a good agreement with the data from simulation and measurement.
机译:对100nm以下nnm和Flash存储器单元晶体管的阈值电压$(V_ {rm th})$位移进行了系统建模,并通过与来自测量和3-D器件仿真的数据进行比较,验证了该建模。通过改变参数(例如栅极长度,宽度,漏极电压,单元之间的介电材料,单元之间的空间,轻掺杂漏极深度和相邻单元)来研究nand闪存单元的$ V_ {rm th} $位移偏压。该模型涵盖了两个主要的器件物理:相邻单元之间的电容耦合效应和短通道效应。我们的模型显示了nand Flash存储阵列的$ V_ {rm th} $偏移的准确预测,并且与来自仿真和测量的数据有很好的一致性。

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