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首页> 外文期刊>Electron Devices, IEEE Transactions on >Impact of Lateral Asymmetric Channel Doping on 45-nm-Technology N-Type SOI MOSFETs
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Impact of Lateral Asymmetric Channel Doping on 45-nm-Technology N-Type SOI MOSFETs

机译:横向非对称沟道掺杂对45nm技术N型SOI MOSFET的影响

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摘要

Lateral asymmetric channel doping is applied to 45-nm technology NFET devices. The measured effective drain-current enhancement over coprocessed symmetric control devices is 10%. Analysis reveals that the dominant physical mechanism, which accounts for two-third of the total enhanced drain current, is an 8% increase in the source-side injection velocity. The remaining one-third is attributed to the decreased drain-induced barrier lowering. This paper concludes with an analysis of the switching characteristics of CMOS inverters composed of an asymmetric NFET and a companion symmetric PFET and shows a 5% improvement in the delay. The improvement is explained in terms of the increased velocity and 30% reduction in drain junction capacitance.
机译:横向非对称沟道掺杂应用于45 nm技术NFET器件。在共处理对称控制设备上测得的有效漏极电流增强为10%。分析表明,占总增强漏极电流三分之二的主导物理机制是源极侧注入速度提高了8%。剩余的三分之一归因于漏极引起的势垒降低的减少。本文最后分析了由非对称NFET和配对对称PFET组成的CMOS反相器的开关特性,并显示出5%的延迟改善。可以通过提高速度并降低漏极结电容30%来解释这种改进。

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