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Laterally asymmetric channel engineering in fully depleted double gate SOI MOSFETs for high performance analog applications

机译:完全耗尽的双栅极SOI MOSFET中的横向非对称通道工程设计,适用于高性能模拟应用

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摘要

An analytical model is developed for laterally asymmetric channel (graded channel (GC)) design in double gate (DG) silicon-on-insulator (SOI) MOSFETs. Based on modeling, 2D simulation and experimental results, we show DG MOSFETs with laterally asymmetric channel engineering can achieve high values of saturation drain current, exceptionally high values of Early voltage (>1600 V) and intrinsic DC gain of 70-80 dB for L_(eff) = 1.64 μm, well in excess of those reported so far. Results of GC DG MOSFETs have also been compared with experimental and simulated data of uniformly doped double and single gate (SG) SOI MOSFETs. The analysis takes into account the effect of length and doping of the high and low doped regions to develop a compact model suitable for device design. The results of analytical model agree well with experimental and simulation data. We propose design guidelines for overall optimum performance of GC DG MOSFETs for realizing future high performance analog circuits.
机译:针对双栅极(DG)绝缘体上硅(SOI)MOSFET中的横向非对称沟道(渐变沟道(GC))设计开发了一种分析模型。基于建模,二维仿真和实验结果,我们显示具有横向非对称沟道设计的DG MOSFET可以实现高饱和漏电流值,极高的早期电压(> 1600 V)值和L_的固有DC增益70-80 dB (eff)= 1.64μm,远远超过迄今为止的报告值。还已将GC DG MOSFET的结果与均匀掺杂的双栅极和单栅极(SG)SOI MOSFET的实验和仿真数据进行了比较。该分析考虑了高掺杂区和低掺杂区的长度和掺杂的影响,从而开发出适用于器件设计的紧凑模型。分析模型的结果与实验和仿真数据吻合良好。我们提出了GC DG MOSFET总体最佳性能的设计准则,以实现未来的高性能模拟电路。

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