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Dual-Material Double-Gate SOI n-MOSFET: Gate Misalignment Analysis

机译:双材料双栅极SOI n-MOSFET:栅极失准分析

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摘要

The dual-material double-gate (DMDG) silicon-on-insulator (SOI) metal–oxide–semiconductor field-effect transistor (MOSFET) is the leading contender for sub-100-nm devices because it utilizes the benefits of both double-gate and dual-material-gate structures. One major issue of concern in the DMDG-MOSFET is the alignment between the top and the bottom gate that critically influences the device performance. In this paper, we have investigated the effects of gate misalignment in the DMDG SOI n-MOSFET. In this regard, analytical modeling and extensive simulations have been carried out to analyze the gate misalignment effects on device performance like surface potential, electric field, threshold voltage, subthreshold slope, drain-induced barrier lowering, drain current, and transconductance. Considering the fact that gate misalignment can occur on any side of the gate, both source- and drain-side misalignments have been discussed. Analytical and simulated results are found to be in good agreement, which authenticate our proposed model for the DMDG structure.
机译:双材料双栅极(DMDG)绝缘体上硅(SOI)金属氧化物半导体场效应晶体管(MOSFET)是100nm以下器件的主要竞争者,因为它利用了两种双栅极的优点。门和双材料门结构。 DMDG-MOSFET中值得关注的一个主要问题是顶栅和底栅之间的对准会严重影响器件的性能。在本文中,我们研究了DMDG SOI n-MOSFET中栅极失准的影响。在这方面,已经进行了分析建模和广泛的仿真,以分析栅极失准对器件性能的影响,例如表面电势,电场,阈值电压,亚阈值斜率,漏极引起的势垒降低,漏极电流和跨导。考虑到栅极失准可能在栅极的任何一侧发生的事实,已经讨论了源极侧和漏极侧失准。分析和模拟结果发现吻合良好,这证明了我们提出的DMDG结构模型。

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