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Oxide Semiconductor-Based Organic/Inorganic Hybrid Dual-Gate Nonvolatile Memory Thin-Film Transistor

机译:基于氧化物半导体的有机/无机混合双栅非易失性存储薄膜晶体管

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An organic/inorganic hybrid dual-gate (DG) nonvolatile memory thin-film transistor (M-TFT) was proposed as a device with high potential for implementing large-area electronics on flexible and/or transparent substrates. The active channel and bottom and top gate insulators (GIs) of the M-TFT were composed of In–Ga–Zn–O, $hbox{Al}_{2}hbox{O}_{3}$, and poly(vinylidene fluoride-trifluoroethylene) [P(VDF-TrFE)], respectively. It was confirmed that the fabricated DG M-TFT showed excellent device characteristics, in which the obtained field-effect mobility, subthreshold swing, and on/off ratio were approximately 32.1 $hbox{cm}^{2} hbox{V}^{-1} hbox{s}^{-1}$, 0.13 V/dec, and $hbox{10}^{8}$, respectively. It was also successfully demonstrated that the DG configuration for the proposed M-TFT could effectively work for improving the device controllability by individually controlling the bias conditions of the top gate and bottom gate (BG). The turn-on voltage could be dynamically modulated and controlled when an appropriate fixed negative voltage was applied to the BG. The required duration of the programming pulse to obtain a memory margin of more than 10 could be reduced to 100 $muhbox{s}$. These results correspond to the first demonstration of a hybrid-type DG M-TFT using a ferroelectric copolymer GI/oxide semiconducting active channel structure and demonstrate the feasibility of a promising memory device embeddable in a large-area electronic system.
机译:提出了一种有机/无机混合双栅(DG)非易失性存储薄膜晶体管(M-TFT),作为一种在柔性和/或透明基板上实现大面积电子器件的高潜力器件。 M-TFT的有源沟道以及底部和顶部栅极绝缘体(GI)由In-Ga-Zn-O,<公式Formulatype =“ inline”> $ hbox {Al} _组成{2} hbox {O} _ {3} $ 和聚(偏二氟乙烯-三氟乙烯)[P(VDF-TrFE)]。证实了所制造的DG M-TFT显示出优异的器件特性,其中获得的场效应迁移率,亚阈值摆幅和开/关比约为32.1。[公式公式类型=“ inline”> $ hbox {cm} ^ {2} hbox {V} ^ {-1} hbox {s} ^ {-1} $ ,0.13 V / dec和 $ hbox {10} ^ {8} $ 。还成功地证明了通过单独控制顶栅和底栅(BG)的偏置条件,所提出的M-TFT的DG配置可以有效地改善器件的可控性。当向BG施加适当的固定负电压时,可以动态调制和控制导通电压。获得大于10的存储余量所需的编程脉冲持续时间可以减少为100 $ muhbox {s} $ 。这些结果对应于使用铁电共聚物GI /氧化物半导体有源沟道结构的混合型DG M-TFT的首次演示,并证明了可在大面积电子系统中嵌入的有前途的存储设备的可行性。

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