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Studies on Halo Implants in Controlling Short-Channel Effects of Nanoscale Ge Channel pMOSFETs

机译:晕植入物在控制纳米Ge沟道pMOSFET的短沟道效应中的研究

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We report the impact of halo implants on short-channel effects of nanoscale Ge channel pMOSFETs in terms of different electrical device parameters such as threshold voltage ($V_{rm TH}$ ), subthreshold slope (SS), and drain-induced barrier lowering. The analysis is based on 2-D surface potential approach taking into account the interface-trapped-charge density, the fixed-oxide-charge density, and halo implants. The higher value of halo concentration as well as halo length shifts the $V_{rm TH}$ toward the more negative value making pMOS devices suitable for circuit applications and also reduces SS. A design space defined by halo concentration and halo length for $V_{rm TH}$ almost independent of channel length has been predicted for Ge pMOS devices with gate lengths down to 20 nm. Results obtained from our model show excellent agreement with numerical simulation data obtained using ATLAS and with reported experimental data.
机译:我们根据不同的电子器件参数(例如阈值电压($ V_ {rm TH} $),亚阈值斜率(SS)和漏极引起的势垒降低)报告了晕圈注入对纳米级Ge沟道pMOSFET的短沟道效应的影响。 。该分析基于二维表面电势方法,并考虑了界面陷阱电荷密度,固定氧化物电荷密度和晕圈注入。较高的晕圈浓度值和晕圈长度会使$ V_ {rm TH} $向更负的值移动,从而使pMOS器件适用于电路应用,并且还减小了SS。对于栅极长度低至20 nm的Ge pMOS器件,已经预测了由$ V_ {rm TH} $的晕圈浓度和晕圈长度定义的设计空间,该空间几乎与沟道长度无关。从我们的模型中获得的结果与使用ATLAS获得的数值模拟数据和报告的实验数据具有极好的一致性。

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