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Evaluation of Electron Trapping Speed of AlGaN/GaN HEMT With Real-Time Electroluminescence and Pulsed $I{-}V$ Measurements

机译:实时电致发光和$ I {-} V $脉冲测量评估AlGaN / GaN HEMT的电子俘获速度

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摘要

A methodology for the evaluation of the electron trapping speed by combining real-time electroluminescence and the ON-resistance is proposed. In real-time electroluminescence measurements with the high sensitivity of a silicon-intensified CCD with low noise characteristics, a shift of the luminescence location from the gate edge to the drain edge was observed even while the device was under continuous biasing. This shift results from the alleviation of an electric field at the gate edge, and an alternative high electric field is produced at the drain edge. Although a drain current was almost stable even when the position of the electroluminescence was shifting, the ON-resistance significantly increased in pulsed $I{-}V$ measurements. Using device simulation, we estimated dependence of the ON-resistance on the density of trapped electrons at the AlGaN surface. From measured and simulated results, the electron-trapping speed is supposed to be approximately $1times{10}^{10}~{rm cm}^{-2}~{rm s}^{-1}$ in the case of the AlGaN/GaN HEMT with a 2.0-$mu{rm m}$-long gate under $V_{rm d}$ and $V_{rm g}$ of 10 and 0 V, respectively.
机译:提出了一种通过结合实时电致发光和导通电阻来评估电子俘获速度的方法。在具有低噪声特性的硅增强CCD的高灵敏度实时电致发光测量中,即使器件处于连续偏置状态,也观察到了发光位置从栅极边缘到漏极边缘的移动。这种偏移是由于栅极边缘处的电场减小而引起的,而在漏极边缘处产生了替代性的高电场。尽管即使在电致发光的位置发生偏移时,漏极电流也几乎稳定,但脉冲 $ I {-} V $ 测量。使用器件仿真,我们估计了导通电阻对AlGaN表面俘获电子密度的依赖性。根据测量和模拟结果,电子俘获速度应近似为<公式:type =“ inline”> $ 1times {10} ^ {10}〜{rm cm} ^ {-2 }〜{rm s} ^ {-1} $ (对于AlGaN / GaN HEMT,其值为2.0- <公式Formulatype =“ inline”> $在 $ V_ {rm d} $ 下的mu {rm m} $ -长门和 $ V_ {rm g} $ 分别为10 V和0V。

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