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首页> 外文期刊>IEEE Transactions on Electron Devices >Interface Traps in InAs Nanowire Tunnel FETs and MOSFETs—Part II: Comparative Analysis and Trap-Induced Variability
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Interface Traps in InAs Nanowire Tunnel FETs and MOSFETs—Part II: Comparative Analysis and Trap-Induced Variability

机译:InAs纳米线隧道FET和MOSFET中的界面陷阱-第二部分:比较分析和陷阱引起的可变性

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摘要

This paper extends the analysis of the companion paper by presenting a comparative analysis of the impact of interface traps on the $I{-}V$ characteristics of InAs nanowire tunnel FETs or MOSFETs with a spatially random distribution of traps. The physical mechanisms behind the effects of traps in either tunnel FETs or MOSFETs are compared and, furthermore, traps are also investigated as a possible source of device variability. Our results show that, in MOSFETs, an aggressive oxide thickness scaling can effectively counteract the degradation of the subthreshold slope (SS) possibly produced by interface traps. Tunnel FETs are instead more vulnerable to traps, which are probably the main hindrance to the experimental realization of tunnel FETs with an SS better than 60 mV/decade.
机译:本文通过对接口陷阱对 $ I {-} V $ <具有陷阱的空间随机分布的InAs纳米线隧道FET或MOSFET的特性。比较了隧道FET或MOSFET中陷阱的背后的物理机制,此外,还研究了陷阱作为器件可变性的可能来源。我们的结果表明,在MOSFET中,积极的氧化物厚度缩放可以有效抵消界面陷阱可能产生的亚阈值斜率(SS)的下降。相反,隧道FET更容易受到陷阱的影响,这可能是SS优于60 mV /十年的隧道FET实验实现的主要障碍。

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