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Characterization of the Depth Distribution and Electrical Activation and Deactivation of Ion Implanted Dopants in Silicon

机译:硅中离子注入掺杂剂的深度分布以及电激活和去激活的表征

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Electrical-assisted diffusion of carriers is proposed as a hypothesis of major dopant deactivation kinetics. New metrology methods, including SIMS/ARXPS and continuous anodic oxidation technique/differential Hall effect methods, are used in this paper to supply supporting evidences and data. The n-type (P- and As-based) implants show more serious deactivation, but similar reactivation to p-type (B-based) implants, which can be interpreted by the electrical-assisted diffusion mechanism. Reactivation occurs only when the excess dopants exist—dopant concentration is higher than its electrically active solid solubility limit.
机译:载流子的电辅助扩散被提出为主要掺杂物失活动力学的假设。本文采用新的计量方法,包括SIMS / ARXPS和连续阳极氧化技术/差分霍尔效应方法,以提供支持性证据和数据。 n型(基于P和As的)植入物表现出更严重的失活,但与p型(基于B的)植入物的活化类似,这可以通过电辅助扩散机制来解释。仅当存在过量的掺杂剂时才发生再活化-掺杂剂浓度高于其电活性固溶极限。

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