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Modeling and Separate Extraction Technique for Gate Bias-Dependent Parasitic Resistances and Overlap Length in MOSFETs

机译:MOSFET中与栅极偏置相关的寄生电阻和重叠长度的建模和独立提取技术

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摘要

We report a technique for separate extraction of extrinsic source/drain (S/D) resistances (R/R) and gate bias (V)-dependent but channel length (L)-independent intrinsic source/drain (R/R) resistances for the overlap region in MOSFETs. For extraction of the overlap length (L) in the heavily doped S/D regions, an analytical capacitance model for the depletion region is employed with the gate-to-source and gate-to-drain capacitance-voltage (C, C) characteristics. After verifying the extracted overlap length through a 2-D technology computer-aided design simulation, we successfully extract V-dependent R = 0.9~3.7 Ω and R = 1.0~3.9 Ω in an n-channel MOSFET with W = 140 μm and L = 0.35 μm. In addition, V- and L-independent extrinsic S/D resistances are separately extracted to be R = 5.1 Ω and R = 5.0 Ω, respectively.
机译:我们报告了一种独立提取外部源极/漏极(S / D)电阻(R / R)和栅极偏置(V)依赖但沟道长度(L)独立的固有源极/漏极(R / R)电阻的技术MOSFET的重叠区域。为了提取重掺杂S / D区域中的重叠长度(L),采用了具有栅极到源极和栅极到漏极的电容电压(C,C)特性的耗尽区的分析电容模型。在通过二维技术计算机辅助设计仿真验证了提取的重叠长度之后,我们在W = 140μm和L的n沟道MOSFET中成功提取了与V相关的R = 0.9〜3.7Ω和R = 1.0〜3.9Ω = 0.35微米。此外,独立于V和L的外部S / D电阻分别提取为R = 5.1Ω和R = 5.0Ω。

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