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Self-Aligned Coplanar Top Gate In–Ga–ZnO Thin-Film Transistors Exposed to Various DUV Irradiation Energies

机译:自对准共面顶栅In-Ga-ZnO薄膜晶体管暴露于各种DUV辐射能量

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摘要

Self-aligned coplanar top gate indium-gallium-zinc-oxide thin-film transistors (TFTs), with source/drain (S/D) regions that were heavily doped by various deep-ultraviolet (DUV) irradiation energies at dual wavelengths of 185 and 254 nm, were investigated. The electrical performances of TFTs improved as the DUV irradiation energy increased. The proposed TFTs, with DUV irradiation of 20 J/cm2, have a field-effect mobility of 22.0 cm2/V · s, a threshold voltage of 2.2 V, a subthreshold swing value of 0.24 V/decade, and an on/off current ratio of 1.34 × 106. In addition, the channel length modulation (AL) and the width-normalized contact resistance (RSDW) were 1.04 μm and 60.5 Ω · cm, respectively. Such short AL and low RSDW values indicate that the S/D regions were properly formed by the DUV irradiation. This simple and cost-effective doping technique can be useful for the fabrication of self-aligned TFTs.
机译:自对准共面顶栅铟镓锌氧化物薄膜晶体管(TFT),其源极/漏极(S / D)区被各种深紫外线(DUV)辐射能量在185的双波长下重掺杂研究了254nm和254nm。随着DUV照射能量的增加,TFT的电性能得到改善。拟议的TFT在DUV照射下为20 J / cm2,场效应迁移率为22.0 cm2 / V·s,阈值电压为2.2 V,亚阈值摆幅值为0.24 V /十倍,开/关电流比率为1.34×106。此外,沟道长度调制(AL)和宽度归一化接触电阻(RSDW)分别为1.04μm和60.5Ω·cm。如此短的AL和低RSDW值表明S / D区是通过DUV辐照正确形成的。这种简单且具有成本效益的掺杂技术可用于制造自对准TFT。

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