机译:热电MEMS微波功率传感器的新型3-D等效电路模型
Nanjing Univ Posts & Telecommun Coll Elect & Opt Engn Nanjing 210023 Peoples R China|Nanjing Univ Posts & Telecommun Coll Microelect Nanjing 210023 Peoples R China;
Nanjing Univ Posts & Telecommun Coll Elect & Opt Engn Nanjing 210023 Peoples R China|Nanjing Univ Posts & Telecommun Coll Microelect Nanjing 210023 Peoples R China;
Nanjing Univ Posts & Telecommun Coll Elect & Opt Engn Nanjing 210023 Peoples R China|Nanjing Univ Posts & Telecommun Coll Microelect Nanjing 210023 Peoples R China;
Nanjing Univ Posts & Telecommun Coll Elect & Opt Engn Nanjing 210023 Peoples R China|Nanjing Univ Posts & Telecommun Coll Microelect Nanjing 210023 Peoples R China;
Sensors; Integrated circuit modeling; Microwave circuits; Electromagnetic heating; Micromechanical devices; Microwave integrated circuits; Solid modeling; 3-D equivalent circuit model; 3-D temperature distribution; microelectro-mechanical system (MEMS); microwave power sensor; time constant;
机译:基于傅立叶等效模型的热电长度微机电系统微波功率传感器的灵敏度
机译:MEMS技术的热电微波功率传感器3D模型
机译:间接加热热电功率传感器的等效集总电路模型和S参数
机译:MEMS技术热电微波功率传感器的3D模型
机译:使用等效电路模型在高功率,高频微波放大器中使用等效电路模型对氮化镓高电子迁移率晶体管的可靠性研究
机译:MEMS技术的热电微波功率传感器3D模型
机译:基于mEms技术的热电微波功率传感器三维模型
机译:微机械惯性传感器的等效电路模型