首页> 外文期刊>IEEE Transactions on Electron Devices >Influence of Cu Doping in Si–Te-Based Chalcogenide Glasses and Thin Films: Electrical Switching, Morphological and Raman Studies
【24h】

Influence of Cu Doping in Si–Te-Based Chalcogenide Glasses and Thin Films: Electrical Switching, Morphological and Raman Studies

机译:Cu掺杂在Si-TE的硫属化物玻璃和薄膜中的影响:电气开关,形态和拉曼研究

获取原文
获取原文并翻译 | 示例
           

摘要

To understand the electrical switching behavior of Si15Te85-xCux (1 <= x <= 10) series, I-V characterization has been performed on bulk as well as amorphous thin films of the as-prepared samples. Both the bulk glasses and amorphous thin films are found to manifest memory-type switching behavior. The threshold voltages of thin-film devices are found to be much lower than the bulk counterparts and hence could find application for phase change memory (PCM). The composition analyses of both have divulged the existence of intermediate phase (IP) in the composition range of 2 <= x <= 6. To examine the probability of the given glass for PCM application, Set-Reset studies have been performed on the glasses with a triangular pulse of 6 mA for set operation and rectangular pulse of 12 mA for the reset operation. The study has revealed a continuous repetition of few Set-Reset cycle by the Si-Te-Cu series. Raman studies carried out on the bulk glasses report the occurrence of blue shift over the composition in a regular manner. Further, SEM studies have been carried out on Si-Te-Cu samples to understand the morphological changes that would have occurred during switching. Additionally, thickness dependence of threshold voltage of representative Si(5)Te(80)Cu(5)and Si15Te76Cu9 glasses has been carried out to reveal the relationship between threshold voltage and thickness.
机译:要了解Si15te85-Xcux的电气切换行为(1 <= x <= 10)系列,I-V表征已经在散装中以及制备样品的无定形薄膜进行。散装眼镜和非晶薄膜都被发现表现出记忆型切换行为。发现薄膜装置的阈值电压远低于散装对应物,因此可以找到相变存储器(PCM)的应用。两者的组合物分析泄露了2 <= x <= 6的组成范围内中间相(IP)的存在。为了检查给PCM应用的给定玻璃的概率,在眼镜上进行了设定复位研究具有6 mA的三角形脉冲,用于设置操作和12 mA的矩形脉冲进行复位操作。该研究揭示了Si-Te-Cu系列少量设定复位周期的连续重复。在散装眼镜上进行的拉曼研究报告了以规则的方式报告了在组合物上的蓝色移位的发生。此外,已经对Si-Te-Cu样本进行了SEM研究以了解在切换过程中发生的形态变化。另外,已经进行了代表性Si(5)Te(8)Cu(5)和Si15Te76Cu9玻璃的阈值电压的厚度依赖性以揭示阈值电压和厚度之间的关系。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号